Package of lightemitting diode with protective element

Abstract

A package structure of light-emitting diode with an electrostatic protective diode is disclosed. The structure comprises a light-emitting diode, an electrostatic protective diode, an electrical & heat conductive pad, and an electrical & heat conductive base substrate. The light-emitting diode is flipped and with its p-electrode and n-electrode, respectively, mounted on the n-electrode of the electrostatic protective diode and the electrical & heat conductive pad by conductive bumps. The latter two are separated themselves by a gap or an insulation layer and both of them are mounted on and electrically connected to the electrical & heat conductive base substrate. The structure is then through a bonding wire bonding to a bonding pad and the electrical & heat conductive base substrate, respectively, connected to a positive and a negative terminal of a DC power to implement the electrical connection. Forgoing bonding pad is located on the exposed portion of n-electrode of the electrostatic protective diode

Dependencies are inferred from the claim text.