Process for fabricating optical switches
AssigneeCabot Microelectronics Corporation
InventorsChris C. Yu, Vlasta Brusic
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Abstract
A process for fabricating micro-acousto-optic modulators using microelectronics fabrication technology. First, a set of trenches is etched into a substrate. Then, a transducer material is deposited into these trenches, followed by removal of any transducer material located above the surface of the substrate. Next, a second set of trenches is etched on both sides of the transducer material, between the transducer material and the substrate. Then, an electrode material is deposited into the second set of trenches. Finally, any electrode material located above the surface of the substrate is removed such that the surface of the substrate is co-planar with the electrode and transducer materials.
Claims53
A process for fabricating micro-acousto-optic modulators, comprising:
- a) etching a first set of trenches into a substrate having an exposed top surface;
- b) depositing a transducer material onto the exposed substrate surface and into the first set of trenches to form at least one transducer;
- c) removing the transducer material from the surface of the crystal substrate;
- d) etching a second set of trenches into the substrate and adjacent to the transducer material, such that the transducer is sandwiched between two trenches;
- e) depositing an electrode material onto the exposed substrate surface and into the second set of trenches to form at least two electrodes;
- and
- f) removing electrode material from the surface of the substrate.
A process for fabricating micro-acousto-optic modulators, comprising:
- a) forming a substrate having an exposed top surface;
- b) depositing a first layer of electrode material onto the surface of the substrate;
- c) depositing a layer of transducer material onto the first layer of electrode material;
- d) patterning the substrate, the first layer of electrode material and the transducer material to form a first plurality of features, each having a top surface, and to form gaps between the features;
- e) depositing a layer of first material on top of the first plurality of features and into the gaps;
- f) polishing the first material layer to form a co-planer surface comprising the transducer material layer and the first material layer, wherein the first material layer remains in the gaps;
- g) depositing a second layer of electrode material onto the co-planer surface;
- h) patterning the second electrode material layer and the transducer material layer to form a second plurality of features, each having a top surface, and to form gaps between the second plurality of features, wherein a portion of the first electrode layer is exposed in the gaps;
- i) depositing a layer of second material on top of the second plurality of features and into the gaps;
- j) patterning the second material layer to form at least one pair of interconnection trenches, wherein one interconnection trench exposes a portion of the first electrode material layer and the other trench exposes a portion of the second electrode material layer;
- k) depositing a third layer of electrode material onto the surface of the second material layer and into the interconnection trenches;
- l) patterning the third layer of electrode material to form pads of electrode material, wherein each pad is connected to only one interconnection trench containing third electrode material.
A micro-acousto-optic modulator comprising:
- a) a substrate having at least one inlay comprising a first layer of electrode material;
- b) a layer of transducer material;
- and
- c) a second layer of electrode material;
- wherein the layer of transducer material is located between the first layer of electrode material and the second layer of electrode material.
A micro-acousto-optic modulator comprising:
- a) a substrate having an exposed surface;
- b) a first layer of electrode material attached to the surface of the substrate;
- c) a layer of transducer material attached to the first layer of electrode material;
- and
- d) a second layer of electrode material attached to the layer of transducer material.
Dependencies are inferred from the claim text.