Sputtering target and method for fabricating the same
AssigneeFujitsu Limited
InventorTakashi Hasegawa
Life of this patent
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Abstract
The sputtering target comprises a backing plate 10, a copper target 12 provided on the backing plate 10, and a protection layer 14 formed on the surface of the copper target 12 and having corrosion-resistant metal. Accordingly, the oxidation of the copper target 12 can be suppressed. Thus, the formation of a contaminant layer on the shielding plate of the sputtering system can be suppressed, and resultantly the adhesion of particles to a substrate due to the release of a deposited layer on the surface of the shielding plate can be suppressed.
Claims19
A sputtering target comprising:
- a target base of copper;
- and
- a protection layer formed on the surface of the target base and formed of corrosion-resistant metal.
A method for fabricating a sputtering target comprising the step of:
- forming a protection layer of a corrosion-resistant metal on the surface of a target base of copper.
A sputtering method for depositing copper on a substrate by using a sputtering target comprising a target base of copper, and a protection layer formed on the surface of the target base and formed of a corrosion-resistant metal, comprising the steps of:
- pre-sputtering the sputtering target to remove the protection layer;
- and
- sputtering the target base to deposit copper on the substrate.
A method for storing a sputtering target comprising a target base of copper, and a protection layer formed on the surface of the target base and formed of a corrosion-resistant metal in a vacuum package.
A method for transporting a sputtering target comprising a target base of copper, and a protection layer formed on the surface of the target base and formed of a corrosion-resistant metal in a vacuum package.
Dependencies are inferred from the claim text.