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AssigneeLexmark International, Inc.
InventorsAshok Murthy, Richard Earl Corley JR., Kris Ann Reeves, Jeanne Marie Saldanha Singh, Paul Timothy Spivey
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The invention relates to a method for attaching a semiconductor chip to an ink jet pen body and improved construction techniques therefor. According to the method a first adhesive have a cure time greater than about 15 minutes is dispensed in a predetermined pattern in one or more chip pockets of an ink jet pen body. Beads containing a second adhesive are dispensed in two or more discrete locations around an inside perimeter of each chip pocket. A semiconductor chip having chip edges is attached to the second adhesive in each of the chip pockets and the first adhesive is cured using heat or radiation. Use of a dual adhesive system improves the alignment of the semiconductor chips relative to one another until the first adhesive is completely cured.
A method for attaching a semiconductor chip to an ink jet pen body which comprises:
A method for assembling a multi-color ink jet pen which comprises:
An adhesive transfer pin for applying beads of adhesive having a height to width ratio of from about 0.12:1 to about 1.667:1 to a chip pocket of an ink jet pen comprising an elongate shaft having a length ranging from about 5 to about 20 millimeters, a shaft width ranging from about 1.5 to about 3 millimeters, a flange portion attached to one end of the shaft, the flange portion having a width ranging from 3 to about 6 millimeters and two or more elongate projections pending from the flanged portion having a length ranging from about 0.5 to about 3.0 millimeters and an average width ranging from about 0.2 to about 1.5 millimeters.
A method for applying beads of adhesive having a height to width ratio of from about 0.12:1 to about 1.667:1 to a chip pocket of an ink jet pen which comprises providing an adhesive transfer pin containing an elongate shaft having a length ranging from about 5 to about 20 millimeters, a shaft width ranging from about 1.5 to about 3 millimeters, a flange portion attached to one end of the shaft, the flange portion having a width ranging from 3 to about 6 millimeters and two or more elongate projections pending from the flanged portion having a length ranging from about 0.5 to about 3.0 millimeters and an average width ranging from about 0.2 to about 1.5 millimeters, dipping the projections, flange portion and a portion of the shaft of the adhesive transfer pin in an adhesive container, removing a bead of adhesive from the container attached to the adhesive transfer pin and depositing one or more beads of adhesive to a chip pocket of an ink jet pen body.
Dependencies are inferred from the claim text.