Transition flow treatment process and apparatus
AssigneeFSI International, Inc.
InventorsKurt Karl Christenson, Nam Pyo Lee, Gary William Michalko, Christina Ann Rathman
Life of this patent
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Abstract
A method is provided for treating an object. In this method, a treating chemical is introduced to a bath under conditions effective to at least partially envelop the object to be treated in eddy currents of the bath liquid, followed by introducing non-treating liquid into the bath under conditions effective to at least partially envelop the object to be treated in eddy currents of the bath liquid. An apparatus for carrying out this method is also provided. This method is particularly beneficial for objects used in precision manufacturing by treatment with solutions, such as semiconductor wafers or similar substrates.
Claims41
A method of treating an object having a surface to be treated comprising, in order:
- a) providing the object in a bath of non-treating liquid;
- b) introducing treating chemical into the bath under conditions effective to at least partially envelop the object to be treated in eddy currents of the bath liquid;
- and
- c) introducing non-treating liquid into the bath under conditions effective to at least partially envelop the object to be treated in eddy currents of the bath liquid.
A method of treating at least one object, comprising the steps of:
- a) causing the object to be immersed in a flowing, substantially nonreactive bath;
- b) spatially, uniformly transitioning the bath from a substantially nonreactive bath to a bath comprising a first treatment chemical;
- and
- c) spatially, uniformly transitioning the bath comprising the first treatment chemical to a substantially nonreactive bath.
A method of treating at least one object, comprising the steps of:
- a) immersing an object in a bath comprising a liquid;
- b) while the object is immersed in the bath, mixingly introducing a treatment chemical into the bath, thereby increasing the concentration of the treatment chemical in the bath in a non-step manner;
- c) while the object is immersed in the bath comprising the treatment chemical, mixingly introducing a liquid into the bath under conditions such that the concentration of the treatment chemical in the bath is reduced in a non-step manner.
A method of treating an in-process semiconductor wafer having a surface to be treated comprising, in order:
- i. providing the semiconductor wafer in a bath of non-etching liquid;
- ii. introducing an etching chemical into the bath under conditions effective to at least partially envelop the semiconductor wafer to be treated in eddy currents of the bath liquid;
- and
- iii. introducing non-etching liquid into the bath under conditions effective to at least partially envelop the semiconductor wafer to be treated in eddy currents of the bath liquid.
An apparatus for treating objects by application of liquid to the objects when supported therein, comprising:
- a vessel having an internal chamber defined therein by a sidewall and a bottom wall for maintaining a bath of liquid therein;
- at least one liquid distribution head operatively connected to said vessel for introducing treatment chemical into the vessel;
- a mixing element for generating eddy currents to at least partially envelop an object to be treated when supported therein;
- and
- a supply pipe operatively connected with the at least one liquid distribution orifice and for connection to a liquid source;
- wherein said mixing element is positioned to provide uniform introduction of treatment chemical to an object when supported in a bath of liquid in the internal chamber.
Dependencies are inferred from the claim text.