Poly(arylene ether) polymer with low temperature crosslinking grafts and adhesive comprising the same

Abstract

A poly(arylene ether) polymer includes polymer repeat units of the following structure: —(O—Ar1—O—Ar2—O—)m—(—O—Ar3—O—Ar4—O)n— where Ar1, Ar2, Ar3, and Ar4 are identical or different aryl radicals, m is 0 to 1, n is 1-m, and at least one of the aryl radicals is grafted to at least one unsaturated group that is non-aromatic and is adapted to crosslink at a curing temperature below 200° C. without producing volatiles during curing and without providing functional groups aftercuring. Cured films containing the polymer can have a Tg from 160° C. to 180° C., a dielectric constant below 2.7 with frequency independence, and a maximum moisture absorption of less than 0.17 wt %. Accordingly, the polymer is especially useful in interlayer dieletrics and in die-attach adhesives.

Dependencies are inferred from the claim text.