Method of manufacturing semiconductor devices
OwnerMasahide Shinoharainventor
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Abstract
A semiconductor device manufacturing method by which an organic resin film is formed on a semiconductor substrate in which integrated circuit elements and a wiring pattern have been formed and the entire circuit is sealed in a mold resin, includes a step of using an exposure mask having at least a pattern finer than the resolution limit of the organic resin to form a plurality of cavities on the surface of the organic resin film.
Claims5
A semiconductor device manufacturing method that forms an organic resin film on a semiconductor substrate in which integrated circuit elements and a wiring pattern are formed and seals the entire circuit in a mold resin, comprising a step of forming a plurality of cavities on the surface of the organic resin film by using an exposure mask on which at least a pattern finer than the resolution limit of the organic resin is formed.
A semiconductor device manufacturing method that forms an organic resin film on a semiconductor substrate in which integrated circuit elements and a wiring pattern are formed and seals the entire circuit in a mold resin, comprising steps of selectively removing the organic resin film to form an external lead electrode on a part of the wiring pattern and a plurality of cavities on the surface of the organic resin film at the same time, and curing the organic resin film thereafter.
Dependencies are inferred from the claim text.