Routing for multilayer ceramic substrates to reduce excessive via depth
AssigneeInternational Business Machines Corporation
InventorRoger D. Weekly
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Abstract
Aspects for routing in multilayer ceramic substrates that reduces via depth and avoids via bulge are described. The aspects include providing a multilayer ceramic substrate with at least two redistribution layers. Vias for each of a plurality of signal lines are jogged on at least a second redistribution layer of the at least two redistribution layers. Further, the aspects include providing the second redistribution layer no more than seven layers deep in the multilayer ceramic substrate.
Claims19
A method for routing signals in a multilayer ceramic (MLC) substrate to avoid excessive via depth, the method comprising the steps of:
- a) providing a multilayer ceramic substrate with at least two redistribution layers;
- and
- b) jogging vias for each of a plurality of signal lines on at least a second redistribution layer of the at least two redistribution layers.
A integrated circuit carrier apparatus with reduced signal via depth, the apparatus comprising:
- a multilayer ceramic substrate including at least a first and a second redistribution layer;
- and
- a plurality of signal lines routed within the multilayer ceramic substrates jogging in one of the first and second redistribution layers, wherein via-bulge at a surface of the multilayer ceramic substrate is avoided.
A method for routing signals in a multilayer ceramic substrate to avoid excessive via depth, the method comprising the steps of:
- (a) providing a multilayer ceramic substrate;
- and
- (b) limiting via depth within the multilayer ceramic substrate to less than seven layers for each of a plurality of signal lines, wherein via-bulge at a surface of the multilayer ceramic substrate is avoided.
Dependencies are inferred from the claim text.