Dynamic solder attach
OwnerScott L. Kirkmaninventor
Life of this patent
Estimating the term…
Abstract
Disclosed are novel methods and apparatus for efficiently providing dynamic solder attach, in part, to decrease the affects of thermal variations. In an embodiment, a spacer provides a gap between a semiconductor package and a device, an attachment material is disposed between the device and the semiconductor package, and an environmental control device provides an appropriate environment to activate the attachment material. In another embodiment, while the attachment material is substantially activated, the spacer increases the gap between the semiconductor package and the device to elongate the attachment material in a plane substantially perpendicular to the device and the semiconductor package. In yet a different embodiment, the elongated attachment material assumes a substantially hourglass shape.
Claims59
A method of manufacturing an electronic device with reduced susceptibility to damage caused by thermal variations, the method comprising:
- providing a semiconductor package;
- providing a device to be attached to the semiconductor package;
- providing a spacer to provide a gap between the semiconductor package and the device;
- providing attachment material between the device and the semiconductor package;
- positioning the device and the semiconductor package adjacent to each other to provide substantial contact between the device and the semiconductor package via the attachment material;
- providing an appropriate environment to activate the attachment material;
- and
- utilizing the spacer to increase the gap between the semiconductor package and the device while the attachment material is substantially activated,
- wherein the attachment material is elongated in a plane substantially perpendicular to the device and the semiconductor package.
An apparatus comprising:
- a semiconductor package;
- a device to be attached to the semiconductor package;
- a spacer coupled to the semiconductor package and the device to provide a gap between the semiconductor package and the device;
- attachment material disposed between the device and the semiconductor package, the device and the semiconductor package positioned adjacent to each other to provide substantial contact between the device and the semiconductor package via the attachment material;
- and
- an environmental control device to provide an appropriate environment to activate the attachment material,
- wherein, while the attachment material is substantially activated, the spacer increases the gap between the semiconductor package and the device to elongate the attachment material in a plane substantially perpendicular to the device and the semiconductor package.
An apparatus comprising:
- a semiconductor package;
- a device to be attached to the semiconductor package;
- a spacer means to provide a gap between the semiconductor package and the device;
- attachment means disposed between the device and the semiconductor package;
- and
- environmental control means to provide an appropriate environment to activate the attachment means.
An article of manufacture comprising:
- a machine readable medium that provides instructions that, if executed by a machine, will cause the machine to perform operations including:
- actuating a spacer to provide a gap between a semiconductor package and a device;
- providing attachment material between the device and the semiconductor package;
- positioning the device and the semiconductor package adjacent to each other to provide substantial contact between the device and the semiconductor package via the attachment material;
- providing an appropriate environment to activate the attachment material;
- and
- utilizing the spacer to increase the gap between the semiconductor package and the device while the attachment material is substantially activated,
- wherein the attachment material is elongated in a plane substantially perpendicular to the device and the semiconductor package.
Dependencies are inferred from the claim text.