Method and apparatus for slicing semiconductor wafers
AssigneeMEMC Electronic Materials, Inc.
InventorsMilind S. Bhagavat, Dale A. Witte, Steven L. Kimbel, David A. Sager, John W. Peyton
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Abstract
An apparatus for slicing semiconductor wafers from a single-crystal ingot includes a web of wire for slicing the ingot into wafers and a frame having a head for supporting the ingot during slicing. The apparatus further includes a controller and a temperature sensor disposed in the head and operable to send a signal to the controller indicating head temperature. The controller is operable to control temperature of a fluid directed to the head in response to the signal thereby to control the head temperature. Methods of slicing wafers are also disclosed.
Claims21
An apparatus for slicing semiconductor wafers from a single-crystal ingot comprising:
- a web of wire for slicing the ingot into wafers,
- a frame including a head for supporting the ingot during slicing,
- a controller, and
- a temperature sensor disposed in the head and operable to send a signal to the controller indicating head temperature,
- the controller being operable to control temperature of a fluid directed to the head in response to the signal to thereby control the head temperature.
An apparatus for slicing semiconductor wafers from a single-crystal ingot comprising:
- a web of wire for slicing the ingot into wafers,
- a frame including a head for supporting the ingot during slicing, and
- temperature control means for precise temperature control of the head to inhibit waviness in the wafers.
A method of slicing semiconductor wafers from a single-crystal ingot using a wafer slicing apparatus, the method comprising:
- monitoring the temperature of at least one component of the apparatus, and
- initiating slicing of the wafer from the ingot when the temperature of said component is substantially steady at a predetermined temperature so as to inhibit waviness in the wafers.
A method of slicing semiconductor wafers from a single-crystal ingot using a wafer slicing apparatus, the method comprising:
- heating at least one component of the apparatus, and
- initiating slicing of the wafer from the ingot when the temperature of said at least one component is approximately equal to a predetermined temperature so as to inhibit waviness in the wafers.
A method of slicing semiconductor wafers from at least one single-crystal ingot using a wafer slicing apparatus, the method comprising:
- identifying a component of the apparatus in which variations in temperature thereof during slicing promote waviness in the wafer, and
- controlling the temperature of the component during slicing to inhibit waviness in the wafers.
Dependencies are inferred from the claim text.