Semiconductor integrated circuit and method for manufacturing semiconductor integrated circuit

A method for manufacturing a semiconductor integrated circuit, comprising the steps of:

• forming a semiconductor element on a semiconductor substrate;
• attaching a film member on said semiconductor element;
• separating said semiconductor element together with said film member from said semiconductor substrate;
• forming a joining layer on a surface of a member on which said semiconductor element is mounted;
• applying a solution to said joining layer;
• placing said semiconductor element on a portion of said joining layer where said solution has been applied, and
• mounting said semiconductor element on said member.

A method for manufacturing a semiconductor integrated circuit, comprising the steps of:

• forming a semiconductor element on a semiconductor substrate;
• attaching a film member on said semiconductor element;
• separating said semiconductor element together with said film member from said semiconductor substrate;
• forming a first joining layer on said semiconductor element, and a second joining layer on a surface of a member on which said semiconductor element is mounted, and
• dissolving at least one of said first joining layer and said second joining layer so that said semiconductor element is mounted on said member using a dissolved layer as a joining surface.

A method for manufacturing a semiconductor integrated circuit, comprising the steps of:

• forming a semiconductor element on a semiconductor substrate;
• attaching a film member on said semiconductor element;
• separating said semiconductor element together with said film member from said semiconductor substrate;
• closely contacting said semiconductor element and a member on which said semiconductor element is mounted, and
• applying voltage of about 500 to 2,000 V between said semiconductor element and said member so that said semiconductor element is joined to said member.

A method for manufacturing a semiconductor integrated circuit, comprising the steps of:

• forming a semiconductor element on a semiconductor substrate;
• attaching a film member on said semiconductor element;
• separating said semiconductor element together with said film member from said semiconductor substrate, and
• placing a plurality of said semiconductor elements substantially at the same time on a desired member using a plurality of collets.