System for providing an open-cavity low profile encapsulated semiconductor package

A method for wire bonding a finger sensor die to an external circuit, wherein the finger sensor die includes a sensor array having one or more die contacts that are wire bonded to one or more external contacts of the external circuit so that a usable portion of the sensor array is maximized, the method comprises steps of:

• forming a ball at a first end of a bonding wire;
• forming an electrically conductive connection between the ball and a selected external contact of the external circuit;
• extending the bonding wire to a selected die contact so as to form a wire loop having a low loop height;
• forming an electrically conductive stitch connection between a second end of the bonding wire and the selected die contact;
• and
• repeating the above steps until the one or more die contacts are wire bonded to the one or more external contacts of the external circuit.