Electronic device and method of manufacturing the same, and electronic instrument
AssigneeSeiko Epson Corporation
InventorNobuaki Hashimoto
Life of this patent
Estimating the term…
Abstract
After electrically connecting first interconnecting lines respectively to a first group of electrodes of an integrated circuit chip, second interconnecting lines are electrically connected to a second group of electrodes of the integrated circuit chip, respectively. The pitch of the first group of electrodes is wider than that of the second group of electrodes. A first support member has a larger rate of deformation due to at least one of heat and humidity than a second support member.
Claims9
A method of manufacturing an electronic device comprising:
- electrically connecting first interconnecting lines provided on a first support member respectively to a first group of electrodes of an integrated circuit chip;
- and then
- electrically connecting second interconnecting lines provided on a second support member respectively to a second group of electrodes of the integrated circuit chip, the second support member having a rate of deformation due to at least one of heat and humidity less than the deformation rate of the first support member, and the second group of electrodes having a pitch less than the pitch of the first group of electrodes of the integrated circuit chip.
An electronic device manufactured by a method comprising:
- electrically connecting first interconnecting lines provided on a first support member respectively to a first group of electrodes of an integrated circuit chip;
- and then
- electrically connecting second interconnecting lines provided on a second support member respectively to a second group of electrodes of the integrated circuit chip, the second support member having a rate of deformation due to at least one of heat and humidity less than the deformation rate of the first support member, and the second group of electrodes having a pitch less than the pitch of the first group of electrodes of the integrated circuit chip.
An electronic instrument comprising an electronic device manufactured by a method including:
- electrically connecting first interconnecting lines provided on a first support member respectively to a first group of electrodes of an integrated circuit chip;
- and then
- electrically connecting second interconnecting lines provided on a second support member respectively to a second group of electrodes of the integrated circuit chip, the second support member having a rate of deformation due to at least one of heat and humidity less than the deformation rate of the first support member, and the second group of electrodes having a pitch less than the pitch of the first group of electrodes of the integrated circuit chip.
Dependencies are inferred from the claim text.