Methods for forming semiconductor devices so as to stabilize the same when positioned face-down over test substrates

A method of fabricating a semiconductor device component, comprising:

• providing at least one semiconductor device component comprising at least one of a semiconductor device with contact pads exposed at a surface thereof and positioned at or proximate to a centerline thereof and a test substrate with test pads exposed at a surface thereof and positioned at or proximate to a centerline thereof;
• and
• sequentially forming layers of at least one stabilizer on a surface of said at least one semiconductor device component such that said at least one stabilizer protrudes from said surface and includes a plurality of superimposed, contiguous, mutually adhered layers, said at least one stabilizer being located on said surface so as to at least partially stabilize an orientation of said semiconductor device upon disposal thereof face-down on said test substrate.

A method of fabricating a semiconductor device component, comprising:

• placing at least one semiconductor device component comprising at least one of a semiconductor device with contact pads positioned at or proximate to a centerline thereof and a test substrate with test pads positioned at or proximate to a centerline thereof in a horizontal plane;
• recognizing a location and orientation of said at least one semiconductor device component;
• stereolithographically fabricating at least one stabilizer comprising at least one layer of semisolid material on a surface of said at least one semiconductor device component, said at least one stabilizer being configured to at least partially stabilize an orientation of said semiconductor device upon disposal thereof face-down on said test substrate.

A method for stabilizing a semiconductor device that includes contact pads positioned at or proximate to a centerline thereof and that is to be disposed facedown over a test substrate, comprising:

• securing at least one stabilizer configured to at least partially stabilize the semiconductor device to a surface of at least one of the semiconductor device and the test substrate;
• and
• inverting and positioning the semiconductor device over the test substrate so as to establish communication between at least one contact pad of the semiconductor device and a corresponding test pad of the test substrate.