Loading patent…
OwnerSteven L. Stewart, Carlton E. Ashinventors
Estimating the term…
A solid or semi-solid thermoplastic adhesive adhered to a surface mount electronic device; an assembly made of at least a printed circuit board, a surface mount electronic device, solder joints providing a connection between the printed circuit board and the device, and solid thermoplastic adhesive joints attached to the device and the board. The thermoplastic adhesive is at least softened and applied to any available surface on the connecting substrate of the surface mounted electronic device. The thermoplastic adhesive is heated to a temperature sufficient to provide an adhesive joint between the organic surface and the board. There is also provided a thermoplastic adhesive composition having at least the following components: (A) from 5% to 98% by weight of a functionalized polyolefin, and (B) from 2% to 95% by weight of a polyamide compound.
A surface mount electronic device comprising a connecting substrate having a bottom surface and a solid or semi-solid thermoplastic adhesive adhered to a portion of a said bottom surface.
5 The surface mount device of claim 2, wherein the surface mounted electronic device comprises an integrated circuit for flash memory, microprocessor, counter, or timer applications.
An assembly comprising a printed circuit board, a surface mount electronic device comprising an organic connecting substrate, solder joints providing a connection between the substrate and the device and the board, and solid thermoplastic adhesive joints attached to the substrate and the board.
A process for adhering an organic surface of a surface mount electronic device to a printed circuit board, comprising forming an assembly comprised of a printed circuit board, a surface mounted electronic device having a bottom surface, and a solid or semi-solid thermoplastic adhesive disposed between the printed circuit board and the surface mounted electronic device, and heating the thermoplastic adhesive to a temperature sufficient to provide an adhesive joint between the organic surface and the board.
A process for adhering a printed circuit board having landing pads and a surface mount electronic device comprising an organic connecting substrate having an upper surface and a bottom surface, and solder bumps disposed on a bottom surface or having terminal leads disposed on the connecting substrate, comprising:
A process for adhering a printed circuit board comprising landing pads to a surface mount electronic device comprising a connecting substrate having a bottom surface with leads, said process comprising adhering a thermoplastic adhesive onto a portion of said bottom surface, mounting the electronic device onto a printed circuit board to form an assembly in which the leads on said bottom surface are aligned with corresponding landing pads and the thermoplastic adhesive faces the printed circuit board, followed by heating the assembly under solder reflow conditions effective to provide an adhesive joint between said bottom surface and the printed circuit board, wherein the thermoplastic adhesive comprises a functionalized polyolefin.
A process for adhering a printed circuit board comprising landing pads to a surface mount electronic device comprising a connecting substrate having a bottom surface with leads, said process comprising adhering a thermoplastic adhesive onto a portion of said bottom surface, mounting the electronic device onto a printed circuit board to form an assembly in which the leads on said bottom surface are aligned with corresponding landing pads and the thermoplastic adhesive faces the printed circuit board, followed by heating the assembly under solder reflow conditions effective to provide an adhesive joint between said bottom surface and the printed circuit board, wherein the thermoplastic adhesive comprises a polyamide resin in an amount of at least 10 wt. %.
A process for adhering a printed circuit board comprising landing pads to a surface mount electronic device comprising a connecting substrate having a bottom surface with leads, said process comprising adhering a thermoplastic adhesive onto a portion of said bottom surface, mounting the electronic device onto a printed circuit board to form an assembly in which the leads on said bottom surface are aligned with corresponding landing pads and the thermoplastic adhesive faces the printed circuit board, followed by heating the assembly under solder reflow conditions effective to provide an adhesive joint between said bottom surface and the printed circuit board, wherein the thermoplastic adhesive comprises:
A thermoplastic adhesive composition comprising a blend of:
Dependencies are inferred from the claim text.