Ceramic electronic device and method of production of same

A method of production of a ceramic electronic device comprising the steps of:

• forming a first ceramic coating layer on a surface of a substrate,
• forming an internal electrode on a surface of said first ceramic coating layer,
• forming a second ceramic coating layer on a surface of said first ceramic coating layer so as to cover said internal electrode,
• forming other internal electrode of a different layer on a surface of said second ceramic coating layer,
• forming a third ceramic coating layer on the surface of said second ceramic coating layer so as to cover said other internal electrode to thereby form a stack, and
• peeling off said stack from said substrate and successively stacking a plurality of peeled off stacks so that the first ceramic coating layer contained in one stack among two adjoining stacks contacts the third ceramic coating layer contained in the other stack, wherein,
• when a mean particle size of ceramic particles of said first ceramic coating layer is cal, a thickness of said first ceramic coating layer is T1, a mean particle size of ceramic particles of said second ceramic coating layer is α2, a thickness of said second ceramic coating layer is T2, a mean particle size of ceramic particles of said third ceramic coating layer is α3, and a thickness of said third ceramic coating layer is T3, the conditions of α1≦α2, α1≦α3, 0.05 μm<α1≦0.35 μm, T1<T2, T1<T3, and 0μm<T1<1.5 μm are satisfied.

A ceramic electronic device comprising:

• a ceramic body comprised of ceramic layers stacked together and
• a plurality of internal electrodes stacked inside said ceramic body via said ceramic layers, wherein
• at least one of said ceramic layers present between pairs of adjoining internal electrodes is a multilayer structure of a first ceramic layer and a second ceramic layer and,
• when a mean particle size of ceramic particles of said first ceramic layer is α1, a thickness of said first ceramic layer is T1, a mean particle size of ceramic particles of said second ceramic layer is α2, and a thickness of said second ceramic layer is T2, the conditions of α1≦α2, 0.05 μm<α1≦0.35 μm, and T1<T2, 0 μm<T1≦1.5 μm are satisfied.

A ceramic electronic device comprising:

• a ceramic body comprised of ceramic layers stacked together and
• a plurality of internal electrodes stacked inside said ceramic body via said ceramic layers, wherein
• at least one of said ceramic layers present between pairs of adjoining internal electrodes is a multilayer structure of a first ceramic layer and a third ceramic layer,
• remaining ceramic layers in said ceramic layers present between pairs of adjoining internal electrodes is configured by second ceramic layers alone, and,
• when a mean particle size of ceramic particles of said first ceramic layer is α1, a thickness of said first ceramic layer is T1, a mean particle size of ceramic particles of said second ceramic layer is α2, a thickness of said second ceramic layer is T2, a mean particle size of ceramic particles of said third ceramic layer is α3, and a thickness of said third ceramic layer is T3, the conditions of α1≦α2, α1 ≦α3, 0.05 μm<α1≦0.35 μm, T1<T2, T1<T3, and 0 μm<T1<1.5 μm are satisfied.