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OwnerMasahiro Oguni, Miyoshi Yokura +1inventors
InventorsMasahiro Oguni, Miyoshi Yokura, Toshio Yoshimura
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The present invention provides a heat-resistant resin film with a metal layer strongly bonded to the heat-resistant resin film without deteriorating the physical properties possessed by the heat-resistant resin film, and a wiring board using the heat-resistant resin film with the metal layer. The heat-resistant resin film with the metal layer includes a heat-resistant adhesive coated on at least one side of the heat-resistant resin film, and the metal layer provided on the heat-resistant adhesive by at least one of sputtering, vacuum evaporation, and plating. The heat-resistant adhesive has a glass transition temperature (Tg) of 60° C. to 250° C., generates 250 ppm or less of gases at 100° C. to 300° C., and has an elastic modulus of 0.1 GPa to 3 GPa at 200° C. The wiring board uses the heat-resistant resin film with the metal layer.
A heat-resistant resin film with a metal layer comprising a heat-resistant adhesive coated on at least one side of the heat-resistant resin film, the metal layer being provided on the heat-resistant adhesive, wherein the heat-resistant adhesive comprises a polyimide resin, and is provided by at least one of sputtering, vacuum evaporation, and plating.
Dependencies are inferred from the claim text.