Combined boards and methods for manufacturing the same
AssigneeAraco Kabushiki Kaisha and Daiwa Kasei Kogyo Kabuskiki Kaisha
InventorsHitoshi Heta, Tamotsu Nagaya, Toshiaki Kondo, Masahiko Uchida, Makoto Suzuki
Life of this patent
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Abstract
Combined boards are taught that comprise a second board substrate (12) having a through bore (14) formed therein, a first board substrate (10), and a connector pin (40, 50) received in the through bore (14) of the second board substrate (12). The first and second board substrates overlap such that the through bore (14) of the second board substrate (12) is covered by a first surface (10b) of the first board substrate (10). The connector pin is fusion bonded to a circumferential surface of the through bore (14) and the first surface (10b) of the first board substrate (10).
Claims20
A combined board comprising:
- a first board substrate;
- a second board substrate having a through bore defined therein;
- and
- a connector pin received in the through bore of the second board substrate,
- wherein the first board substrate overlaps the second board substrates such that the through bore of the second board substrate is covered by a first surface of the first board substrate, and the connector pin is fusion bonded to a circumferential surface of the through bore and the first surface of the first board substrate.
A method for manufacturing a combined board that comprises first and second board substrates, comprising:
- overlapping the first and second board substrates such that a through bore formed in the second board substrate is covered by a first surface of the first board substrate;
- and
- feeding a molding material into the through bore of the second board substrate, thereby forming a connector pin in the through bore, and fusion bonding the connector pin to a circumferential surface of the through bore and the first surface of the first board substrate.
An apparatus for combining first and second board substrates and manufacturing a combined board, the first and second board substrate being overlapped such that a through bore formed in the second board substrate is covered by a first surface of the first board substrate, comprising:
- a molding die having a connector pin forming recess and a feeder passage, wherein the connector pin forming recess is arranged and constructed such that a pin forming cavity is defined by the pin forming recess, a circumferential surface of the through bore and the first surface of the first board substrate when the molding die contacts a first surface of the second board substrate in an overlap portion;
- and
- molding material injection means that is arranged and constructed to feed a molding material into the pin forming cavity via the feeder passage.
Dependencies are inferred from the claim text.