Collective method for flush filling of through holes in a substrate

Abstract

This invention proposes a device for the mass filling of through holes in a substrate with a resin or any insulating or conducting product. Process for mass, flush filling of through holes (2) in a substrate (1) with a product (3) utilizing an open scraper (7) or a closed device (4) in lateral movement relative to the primary face of the substrate to press product (3) into said holes, obtaining a flush fill on the first face and an overflow on the second face, characterized by the fact that the scraping device (8) is composed of two flexible edges (9) set in opposition and at an angle α in relation to the substrate greater than or equal to 90° in the scraping zone forming a container for the sheared product, said scraping device moving simultaneously with the scraper (7) or the closed device (4), with the transfer occurring in a zone situated between the two edges (9) of the scraping device.

Dependencies are inferred from the claim text.