Nonoparticles formed with rigid connector compounds
AssigneeInternational Business Machines Corporation
InventorsStephen McConnell Gates, Christopher Bruce Murray
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Abstract
The present invention relates to a novel organosilicon particle having the formula SiaObCcHd. The particle may be coated with an organic film, preferably a rigid connector compound. The present invention also provides a method of using the organosilicon particle and/or rigid connector compound in the formation of a low-k dielectric film.
Claims33
A particle comprising a compound of the formula SiaObCcHd, wherein the mole fraction of a is about 0.05 to 0.5, the mole fraction of b is about 0.05 to 0.5, the mole fraction of c is about 0.05 to 0.5, and the mole fraction of d is about 0 to 0.5.
A nanoparticle comprising a core material and a rigid connector compound.
A process for forming a porous body comprising the steps of:
- (a) providing a plurality of core particles;
- (b) coating said particles with an organic compound;
- (c) placing said organic coated particles in a solvent;
- (d) placing a rigid connector compound into said solvent to displace a portion of said organic compound;
- and
- (e) removing said solvent to form said porous body.
Dependencies are inferred from the claim text.