Colloidal metal solution, process for producing the same, and coating material containing the same
AssigneeIshihara Sangyo Kaisha, Ltd.
InventorMasanori Tomonari
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Abstract
The present invention relates to a colloidal metal solution comprising colloidal metal particles with a sulfur compound of low molecular weight such as mercaptoacetic acid, mercaptopropionic acid, mercaptoethanol, etc. as a protective colloid on the particle surfaces and having a pH of 8-14. According to the present invention, a colloidal metal solution having a high concentration and a distinguished dispersion stability with a small amount of the protective colloid can be provided with a commercially and economically high advantage without any operation such as centrifuge, etc.
Claims26
A colloidal metal solution, which comprises at least colloidal metal particles with a sulfur compound of low molecular weight on the particle surfaces and a dispersion medium, the solution contains not less than 1 wt. % of the colloidal metal particles and has a pH of 8-14.
A process for producing a colloidal metal solution, which comprises a first step of forming colloidal metal particles with a sulfur compound of low molecular weight on the particle surfaces in a solution, a second step of adjusting the solution to a pH of not more than 5, thereby aggregating the colloidal metal particles and recovering the colloidal metal particles by filtration, and a third step of dispersing the recovered colloidal metal particles into a dispersion medium at a pH of 8-14.
Dependencies are inferred from the claim text.