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AssigneeSeiko Epson Corporation
InventorsKatsumi Okamoto, Junji Shirokoshi, Takeshi Aoki
Estimating the term…
The first invention comprises an impact receiving member (41); a first electric contact (43a, 44a) which is disposed on the front side of the impact receiving member; a memory IC substrate (46) which is disposed on and apart from the rear side of the impact receiving member; and a second electric contact (43b, 44b) which is configured by bringing a conductive member extending from the first electric contact into contact with a terminal of the memory IC substrate. The second invention comprises a plurality of contact members; a guide member(s) (42) which is formed with the contact members; an impact receiving member (41) being provided on one surface thereof with said guide member; and a contact protecting member (45) which is disposed on the other surface of the impact receiving member and encompasses a memory IC substrate. The third invention comprises conductive members (43, 44) having connecting terminals relative to an apparatus body-side connector and connecting terminals (43b, 44b) relative to a memory IC substrate, wherein the connecting terminals of the conductive members relative to the memory IC substrate have elasticity. The fourth invention is a connector having contacts in a plurality of lines, wherein among the contacts, a contact at the center side of a substrate is set to have a spring load higher than the other contacts.
A connector with a built-in memory IC which is mounted in a rotary development unit and of which data is read and written by bringing an apparatus body-side connector to be connected with and spaced apart form said connector, comprising:
A connector with a built-in memory IC which is mounted in a rotary development unit and of which data is read and written by bringing an apparatus body-side connector to be connected with and spaced apart form said connector, comprising:
A connector to which a memory IC substrate is detachably attached and which comprises conductive members having connecting terminals relative to an apparatus body-side connector and connecting terminals relative to the memory IC substrate, wherein the connecting terminals of said conductive members relative to the memory IC substrate have elasticity.
A connector comprising a positioning mount portion which is engaged with a front end of a memory IC substrate and a hook portion for engaging a rear end of the memory IC substrate and having contacts which are in contact with terminals of the memory IC substrate by spring force in the state that the memory IC substrate is detachably installed to the connector, wherein said contacts are aligned in a plurality of lines and, among said contacts, a contact at the center side of a substrate is set to have a spring load higher than the other contacts.
Dependencies are inferred from the claim text.