Fiber array with V-groove chip and mount

A fiber array for retaining optical fibers, comprising:

• a first and second chips each having at least one groove formed in a top surface and extending longitudinally from a front face toward a back face, said chip having a bottom, said groove(s) being configured for receiving an individual optical fiber, respectively;
• and
• first and second molded mounts each consisting of polymer material, said mounts each having top, and bottom portions, an open channel being formed through said top portion said channel being configured to receive said first chip for mounting therein;
• said first chip being rigidly secured within said channel of said first molded mount, wherein said channel is configured to provide exposure of the front face and top of first said chip, thereby providing a first fiber array half;
• said second chip being rigidly secured within the channel of said second molded mount, wherein the channel is configured to provide exposure of the front face and top of said second chip, thereby providing a second fiber array half;
• said first fiber array half and said second fiber array half being disposed with respective grooves of one facing respective grooves of the other.

A fiber array for retaining optical fibers, comprising:

• first and second chips each having at least one groove formed in a top surface and extending longitudinally from a front face toward a back face, said chips having a bottom, said groove(s) being configured for receiving an individual optical fiber, respectively;
• first and second molded mounts each consisting of polymer material, said mounts each having top, and bottom portions, an open channel being formed through said top portions said channels being configured to receive said first and second chips for mounting therein, respectively;
• said first chip being rigidly secured within said channel of said first molded mount, wherein said channel is configured to provide exposure of the front face and top of first said chip;
• said second silicon chip being rigidly secured in the channel of said second molded mount, wherein said channel is configured to provide exposure of the front face and top of said second silicon chip;
• and
• means for locking said first and second molded mounts with first and second chips, respectively, together in a manner causing respective opposing grooves to apply a compressive force against associated optical fibers retained therebetween.