Modular heat sinks

An opto-electronic device of the type for transmitting signals between an optical waveguide and a host computer comprising:

• an optical sub-assembly for converting optical signals into electrical signals or electrical signals into optical signals;
• a thermally conductive housing for supporting the optical sub-assembly;
• an optical connector on one end of said housing for receiving the optical waveguide, and for
• aligning the optical waveguide with the optical sub-assembly;
• a printed circuit board mounted in said housing including circuitry for controlling the optical
• sub-assembly, the printed circuit board including a first heat source;
• and
• an electrical connector extending from another end of said housing for transmitting electrical signals between the printed circuit board and the host computer;
• wherein the housing includes:
• a lower portion for supporting the optical sub-assembly and the printed circuit board;
• a heat dissipating cover fixed on top of the lower portion for dissipating heat from inside the housing;
• and
• a first heat sink mounted on the heat dissipating cover above the first heat source for dissipating heat therefrom;
• wherein the heat dissipating cover and/or the first heat sink enclose and seal the housing to prevent leakage of electro-magnetic interference (EMI) from the housing.