Low stress mounting device for photonic integrated circuit chips
OwnerZhene Xu, Alexander Changinventors
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Abstract
The present invention is directed to an apparatus and method for packaging and assembling of optical communication components, such as optoelectronic integrated circuits and photonic integrated circuits. Specifically, the present invention is directed to an apparatus and method for mounting an optical communication component onto a mounting plate whereby the optical communication component is support by multiple support structures, the support structures including support posts or a series of geometrically configured holes, such that the support structures can absorb significant stress that may be created by the different thermal expansion properties between the mounting plate and the mounted optical communication component.
Claims20
A. device for mounting an integrated circuit chip, said device comprising a mounting plate, said mounting plate having a plurality of closely spaced support posts extending therefrom for supporting said integrated circuit chip, wherein said plurality of closely spaced support posts span across the mounting surface of said mounting plate.
A device for mounting an integrated circuit chip, said device comprising a mounting plate having an array of holes, said array of holes having a plurality of closely spaced holes, said array of holes extending across the mounting surface of said mounting plate.
A device for mounting an optoelectronic circuit chip, said device includes a mounting plate having a plurality of closely-spaced support structures extending across the mounting surface of said mounting plate,
- wherein the mounting plate and the optoelectronic circuit chip are made of different material having different thermal expansion properties,
- wherein said mounting plate includes a plurality of grooves for mounting and aligning fiber optic cables to the inputs of the mounted optoelectronic circuit chip,
- wherein each of said plurality of support structures include a support surface for mounting said optoelectronic circuit chip, and
- wherein said plurality of support structures can expand or contract to absorb stress caused by the thermal expansion differences between the mounting plate and the optoelectronic chip.
Dependencies are inferred from the claim text.