Arrangement of integrated ciruits in a memory module
AssigneeNetlist, Inc.
InventorsJayesh R. Bhakta, Robert S. Pauley JR.
Life of this patent
Estimating the term…
Abstract
Integrated circuits utilizing standard commercial packaging are arranged on a printed circuit board to allow the production of 1-Gigabyte and 2-Gigabyte capacity memory modules. A first row of integrated circuits is oriented in an opposite orientation to a second row of integrated circuits. The integrated circuits in a first half of the first row and in the corresponding half of the second row are connected via a signal trace to a first register. The integrated circuits in a second half of the first row and in the corresponding half of the second row are connected to a second register. Each register processes a non-contiguous subset of the bits in each data word.
Claims11
A memory module for a computer comprising:
- a printed circuit board;
- and
- a plurality of identical integrated circuits mounted in a first row and a second row onto at least one surface of the printed circuit board, each identical integrated circuit having a respective orientation indicia, the identical integrated circuits in the second row oriented in an opposite orientation direction from the orientation direction of the identical integrated circuits in the first row.
A memory module comprising:
- a printed circuit board;
- a plurality of identical integrated circuits mounted in a first row and a second row onto at least one surface of the printed circuit board;
- a control logic bus connected to the plurality of identical integrated circuits;
- and
- a first register and a second register connected to the control logic bus, the first register addressing the identical integrated circuits located in the first row and the second row of identical integrated circuits on a first lateral half of the at least one surface of the printed circuit board, and the second register addressing the identical integrated circuits located in the first row and the second row of identical integrated circuits on a second lateral half of the at least one surface of the printed circuit board.
A memory module comprising:
- a printed circuit board;
- a plurality of identical integrated circuits mounted in a first row and a second row onto at least one surface of the printed circuit board;
- a control logic bus connected to the plurality of identical integrated circuits;
- and
- a first register and a second register connected to the control logic bus, the first register accessing a first range and a second range of data bits, the second register accessing a third range and a fourth range of data bits, the first range and the second range of data bits being first and second non-contiguous subsets of a data word, and the third range and the fourth range of data bits being third and fourth non-contiguous subsets of the data word.
A method for arranging integrated circuit locations on a printed circuit board for a memory module comprising:
- placing locations for integrated circuits in a first row and a second row onto at least one surface of a printed circuit board;
- and
- orienting the integrated circuit locations in the second row 180 degrees relative to an orientation of the integrated circuit locations in the first row.
A method for manufacturing memory modules comprising:
- placing locations for integrated circuits in a first row and a second row onto at least one surface of a printed circuit board;
- orienting the integrated circuit locations in the second row 180 degrees relative to an orientation of the integrated circuit locations in the first row;
- interconnecting the integrated circuit locations in a first half of the first row and the integrated circuit locations in the first half of the second row to a first register location;
- interconnecting the integrated circuit locations in a second half of the first row and the integrated circuit locations in the second half of the second row to a second register location;
- and
- placing identical integrated circuits on the printed circuit board at the integrated circuit locations.
A 1-Gigabyte capacity memory module comprising 36 integrated circuits of type 256-Megabit SDRAM organized as 64 Meg by 4 bits in a TSOP package having an approximate dimension of 5.25 inches wide by 2.05 inches high, the integrated circuits arranged in two rows on each of two surfaces of a printed circuit board.
A 2-Gigabyte capacity memory module comprising 36 integrated circuits of type 512-Megabit SDRAM organized as 128 Meg by 4 bits in a TSOP package having an approximate dimension of 5.25 inches wide by 2.05 inches high, the integrated circuits arranged in two rows on each of two surfaces of a printed circuit board.
Dependencies are inferred from the claim text.