Back to results
US 2003/0169571 A1Published application
Module and method of manufacturing the module
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorJunichi Kimura
Life of this patent
Estimating the term…
Abstract
A high-frequency module has a signal electrode provided on a cut side thereof and arranged to produce no burrs. The module includes a substantially four-sided substrate, a recess at the cut side of the substrate, and a signal electrode at the recess. The signal electrode is isolated from the cut side by an absent distance.
Claims20
A module comprising:
- a substantially four-sided substrate having a first recess formed at a lateral side thereof;
- an electrode at the first recess of said substrate, isolated by an absent distance from the lateral side of said substrate;
- and
- an electronic component mounted on said substrate.
1 more element
A method comprising the steps of:
- forming a hole at a joint between substrates in a mother board which incorporates the substrates each having substantially a four-sided shape;
- forming a metal-plated portion around the hole and on a internal side of a lateral side of the hole;
- covering the metal plated portion with a resist;
- curing the resist;
- placing a mask over the resist and then exposing the resist to light to develop an absent region along the joint;
- removing the resist from the absent region;
- and
- removing a portion of the metal-plated portion, the portion corresponding to the absent region.
5 more elements
A method of manufacturing a module, comprising the steps of:
- forming a hole at a joint between substrates in a mother board which incorporates the substrates each having substantially a four-sided shape;
- forming a metal-plated portion around the hole and on a internal side of a lateral side of the hole;
- covering the metal plated portion with a resist;
- placing a mask over the resist, and then exposing a portion of the resist corresponding to except an absent region along the joint to light to develop the portion for curing the portion;
- removing the resist except the cured portion;
- and
- removing a portion of the metal-plated portion, the portion corresponding to the absent region.
4 more elements
Dependencies are inferred from the claim text.