Method and apparatus for removing heat from an electronic device
AssigneeSun Microsystems, Inc.
InventorsMohammed A. Tantoush, Kenneth Kitlas
Life of this patent
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Abstract
The electronic device with a system for enhancing the cooling of components located therein is provided. The device includes a housing with a fan positioned adjacent the housing and adapted for producing airflow within the housing. The printed circuit board is mounted within the housing, and a heat-producing device is mounted on the printed circuit board. The heatsink is coupled to the heat-producing device, and a shroud is mounted on the printed circuit board and extends up to the heatsink so as to improve airflow in the region adjacent the heatsink.
Claims62
An apparatus for removing heat from a device mounted on a printed circuit board, comprising:
- a heatsink coupled to said device;
- and
- a shroud coupled to said printed circuit board and extending up to said heatsink, said shroud having a generally polyhedron configuration with at least two openings positioned substantially opposite one another for directing airflow through said shroud and towards said heatsink.
An apparatus for increasing airflow near a heatsink mounted on a printed circuit board, the apparatus comprising:
- a shroud coupled to said printed circuit board and extending up to said heatsink, said shroud having a generally polyhedron configuration with at least two openings positioned substantially opposite one another for directing airflow through said shroud and towards said heatsink.
A cooling system, comprising:
- a printed circuit board;
- at least one heat-generating device mounted on said printed circuit board;
- at least one heatsink coupled to said heat-generating device;
- and
- a shroud mounted on said printed circuit board and extending up to said heatsink.
An electronic device, comprising:
- a housing;
- a fan positioned adjacent said housing and adapted for producing airflow within said housing;
- a printed circuit board mounted within said housing;
- a heat-producing device mounted on said printed circuit board;
- a heatsink coupled to said heat-producing device;
- and
- a shroud mounted on said printed circuit board and extending up to said heatsink.
Dependencies are inferred from the claim text.