High density thin film inductive head

A disk drive assembly having a magnetic disk for recording data and a head comprising:

• a first pole piece;
• a pedestal of ferromagnetic material on one end of the first pole piece;
• a back flux closure of ferromagnetic material on the first pole piece across from the pedestal;
• a layer of coils comprising a plurality of loops of conductive material on top of the first pole piece between the pedestal and the back flux closure;
• a hard baked photo-resist material between the pedestal, each coil loop and the back flux closure, wherein the thickness of the photo-resist material relative the coil thickness is reduced;
• a filler between the coil loops on top of the reduced thickness hard baked photo resist material, wherein the pedestal, back flux closure and coils, having the hard baked photo-resist material and filler between each coil loop, are planarized;
• and
• a write gap layer of non-magnetic material on top of the alumina layer.

A method of manufacturing a thin film inductive write head comprising the steps of:

• forming a pedestal and back flux closure on opposite ends of a first pole piece of ferromagnetic material;
• depositing a plurality of coils of conductive materials on top of the first pole piece comprising a plurality of loops having voids between the coil loops;
• depositing a photo-resist material in the voids between the coil loops and hard baking the photo-resist material;
• depositing alumina over the photo-resist material;
• planarizing the pedestal, back flux closure, coils, hard baked photo-resist, and alumina using a chemical mechanical polishing (CMP) process;
• reducing the thickness of the photo-resist material relative the coils using a O2 reactive ion etching (RIE) process;
• applying a filler to fill in gaps between the coils and reduced thickness photo-resist material;
• and
• performing a CMP process to planarize the filler, coils, and back flux closure.