Exposure method and apparatus, method of making exposure apparatus, device and device manufacturing method

An exposure apparatus which repeatedly transfers a pattern of a mask onto a substrate, comprising:

• an illumination system including a light source and which irradiates said mask with an illumination light for exposure;
• a projection optical system arranged between said mask and said substrate and which projects said illumination light from said mask onto said substrate;
• a substrate stage which holds said substrate;
• a mark detection system including a photoelectric device and which detects a mark located on said substrate stage;
• a judgement unit which judges whether it is necessary to update a baseline of said mark detection system based on a predetermined judgement condition;
• a baseline updating unit electrically connected to the judgement unit and which calculates a new baseline when a result of said judgement unit is affirmative;
• and
• a stage control unit electrically connected to the judgement unit and the baseline updating unit and which controls a position of said substrate stage using, when said result of said judgement unit is negative, said baseline of said mark detection system obtained prior to transfer of said pattern of said mask onto said substrate, and, when said result of said judgement unit is affirmative, said new baseline to transfer said pattern of said mask onto said substrate.

An exposure method for transferring a pattern formed on a mask onto a substrate through a projection optical system while synchronously moving said mask and said substrate, comprising steps of:

• irradiating a pattern surface of said mask with said illumination light for exposure at a predetermined incident angle;
• and
• setting a desired projection magnification of said projection optical system in a direction perpendicular to said synchronously moving direction, and
• controlling a position of said substrate using a baseline of a mark detection system, said baseline obtained by consideration of a shift of a projection that occurs when said desired projection magnification is set, wherein said baseline being used to detect an alignment mark on said substrate.

An exposure method for transferring a pattern formed on a reflection mask onto a substrate through a projection optical system which is configured only of a plurality of reflection optical elements, comprising steps of:

• moving synchronously said reflection mask and said substrate;
• adjusting optical characteristics of said projection optical system prior to transfer;
• and
• adjusting a positional relationship between a projection area of a pattern image and said substrate during said synchronous movement so as to compensate a shift of said projection area in an image field of said projection optical system.

An exposure method which repeatedly transfers a pattern of a mask onto a substrate through a projection optical system, comprising steps of:

• monitoring a change in a physical quantity that changes a baseline of a mark detection system configured to detect a mark on the substrate;
• judging whether it is necessary to update said baseline of said mark detection system based at least in part on whether said physical quantity exceeds a predetermined value;
• obtaining, when a judgement result is affirmative, a new baseline;
• controlling, when a judgement result is affirmative, a position of said substrate using said new baseline;
• controlling, when the judgement result is negative, said-position of said substrate using said baseline of said mark detection system;
• and
• performing exposure.

An exposure method which repeatedly transfers a pattern of a mask onto a substrate through a projection optical system, said method comprising steps of:

• judging whether it is necessary to update a baseline of a mark detection system based on a predetermined judgement condition, said mark detection system detecting a mark located on a substrate stage;
• controlling a position of said substrate stage using, when a result of said judgement is negative, said baseline of said mark detection system, said baseline obtained prior to transfer of said pattern of said mask onto said substrate;
• and
• controlling a position of said substrate stage using, when said result of said judgement is affirmative, a new baseline to transfer said pattern of said mask onto said substrate.

A method of making an exposure apparatus which transfers a pattern of a mask onto a substrate, comprising steps of:

• irradiating said mask with an illumination light for exposure using an illumination system which has a light source;
• projecting said illumination light from said mask onto said substrate using a projection optical system arranged between said mask and said substrate;
• changing a projection magnification of said projection optical system using a magnification changing unit;
• holding said substrate using a substrate stage;
• detecting a mark located on said substrate stage using a mark detection system which has a photoelectric device;
• and
• correcting a shift of a projection position of said pattern of said mask after a magnification change using a baseline of said mark detection system on transferring said pattern of said mask onto said substrate using a correction unit,
• wherein:
• said correction unit electrically connected to said magnification changing unit and said mark detection system, and
• said baseline is obtained through consideration of said shift at said magnification change made by said magnification changing unit.

A method of making an exposure apparatus which repeatedly transfers a pattern of a mask onto a substrate, comprising steps of:

• irradiating said mask with an illumination light for exposure using an illumination system which has a light source;
• projecting said illumination light for exposure outgoing from said mask onto said substrate using a projection optical system arranged between said mask and said substrate;
• holding said substrate using a substrate stage;
• detecting a mark located on said substrate stage using a mark detection system including a photoelectric device;
• judging using a judgement unit whether it is necessary to update a baseline of said mark detection system based on a predetermined judgement condition;
• calculating a new baseline, when a result of said judgement unit is affirmative, using a baseline updating unit electrically connected to said judgement unit;
• and
• controlling a position of said substrate stage using a stage control unit electrically connected to said judgement unit and said baseline updating unit, said step of controlling said position including;
• employing, when said result of said judgement unit is negative, said baseline of said mark detection system, said baseline obtained prior to transfer of said pattern of said mask onto said substrate;
• and
• employing, when said result of said judgement unit is affirmative, said new baseline.

A device, comprising:

• means for irradiating a mask with an illumination light;
• means for projecting said illumination light from said mask onto a substrate, said means for projecting arranged between said mask and said substrate;
• means for changing a projection magnification of said means for projecting;
• means for holding said substrate;
• means for detecting a position mark, said means for detecting including a photoelectric device;
• and
• means for correcting a shift of a projection position after a magnification change using a baseline obtained by said means for detecting when transferring said pattern of said mask onto said substrate, said means for correcting electrically connected to said means for changing said projection magnification and said means for detecting said position mark.