Moisture resistant, flexible epoxy/cyanate ester formulation
AssigneeHoneywell International Inc.
InventorsXiao-Qi Zhou, Henry Wevick, Nancy Iwamoto, Shao Wei Li, Alan Grieve
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Abstract
Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a lewis acid catalyst. Preferably the organic component further comprises a bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.
Claims67
A composition comprising an organic component and a filler, wherein the organic component comprises:
- at least one long-chain cycloaliphatic epoxy resin,
- at least one short-chain cycloaliphatic epoxy resin,
- at least one cyanate ester, and
- at least one lewis acid catalyst.
A composition comprising an organic component and a filler, wherein the organic component comprises:
- at least one long-chain cycloaliphatic epoxy resin,
- at least one short-chain cycloaliphatic epoxy resin,
- at least one cyanate ester,
- at least one lewis acid catalyst, and
- at least one bronsted acid co-catalyst.
A composition comprising an organic component and a filler, wherein the organic component comprises:
- at least one long-chain cycloaliphatic epoxy resin,
- at least one short-chain cycloaliphatic epoxy resin,
- at least one cyanate ester,
- at least one lewis acid catalyst,
- at least one bronsted acid co-catalyst, and
- at least one flexibilizing modifier.
Dependencies are inferred from the claim text.