US 2003/0166384 A1 · Polisher for polishing end surface of semiconductor wafer

Abstract

A polishing head for polishing the end surface of a semiconductor wafer has a driver roller, a driving motor for rotating it, a pair of upper and lower follower rollers one above the other parallel to and horizontally separated from the driver roller and an endless polishing belt around these rollers. As the driving motor causes the polishing belt to run around the rollers, the semiconductor wafer is pushed against the polishing belt between the upper and lower follower rollers. A pair of upper and lower tension-controlling rollers are provided for controlling the tension in the polishing belt between the two follower rollers. At least one of these tension-controlling rollers is movable vertically. A polisher is formed with such a polishing head, a holder for holding and rotating the wafer and an attaching device for attaching the polishing head to the polisher.

Claims10

Dependent claims

A polishing head for polishing an end surface of a semiconductor wafer, said polishing head comprising:

a driver roller;
a driving means for rotating said driver roller;
a pair of upper and lower follower rollers one above the other parallel to said driver roller;
an endless polishing belt around said driver roller and said follower rollers;
and
a pair of upper and lower tension-controlling rollers for controlling tension in said polishing belt between said upper and lower follower rollers, said upper tension-controlling roller serving to push down said polishing belt between said upper follower roller and said driver roller, said lower tension-controlling roller serving to push up said polishing belt between said lower follower roller and said driver roller;
wherein said polishing belt runs as said driver roller is rotated.

4 more elements

A polisher for polishing an end surface of a semiconductor wafer, said polisher comprising:

a polishing head;
holding means for holding and rotating said wafer;
and
attaching means for attaching said polishing head to said polisher;
wherein said polishing head comprises:
a driver roller;
a driving means for rotating said driver roller;
a pair of upper and lower follower rollers one above the other parallel to said driver roller;
an endless polishing belt around said driver roller and said follower rollers;
and
a pair of upper and lower tension-controlling rollers for controlling tension in said polishing belt between said upper and lower follower rollers, said upper tension-controlling roller serving to push down said polishing belt between said upper follower roller and said driver roller, said lower tension-controlling roller serving to push up said polishing belt between said lower follower roller and said driver roller;
wherein said polishing belt runs as said driver roller is rotated.

9 more elements

Dependencies are inferred from the claim text.

Polisher for polishing end surface of semiconductor wafer

Life of this patent

Polisher for polishing end surface of semiconductor wafer

Life of this patent

Abstract

Claims10