Integrated system for processing semiconductor wafers

A method for cleaning and drying a workpiece in a process module having a cleaning and drying section and a process section, comprising:

• placing the workpiece on a movable housing;
• moving the movable housing into the cleaning and drying section of the process module;
• cleaning a surface of the workpiece using a cleaning fluid in the cleaning and drying section;
• transferring the workpiece from the moveable housing to a drying mechanism having a spinning wheel;
• and
• drying the workpiece.

An apparatus for processing a workpiece, comprising:

• a movable housing having a plurality of supports;
• a plurality of holding spools for holding the workpiece during a cleaning process, wherein each holding spool is connected to one of the plurality of supports;
• means for rotating the plurality of supports such that the workpiece is rotated during the cleaning process;
• a rotatable wafer transport device for receiving the workpiece from the movable housing so that the workpiece can be dried during a drying process, the transport device having clamps and a release mechanism for securing and releasing the workpiece;
• and
• means for rotating the workpiece during the drying process.

An integrated wafer processing system for processing a plurality of wafers comprising:

• at least one electrochemical mechanical processing subsystem that can deposit metal onto the front surface of wafers;
• at least one chemical mechanical polishing processing subsystem that contains separate wafer entry and wafer exit points;
• and
• a wafer handling subsystem for transporting each of the wafers into and out of the at least one electrochemical mechanical processing subsystem and the at least one chemical mechanical polishing processing subsystem.

An integrated wafer processing system for processing a plurality of wafers comprising:

• at least one deposition processing subsystem for depositing metal onto a front surface of the wafers;
• an annealing chamber;
• at least one chemical mechanical polishing processing subsystem that contains separate wafer entry and wafer exit points;
• and
• a wafer handling subsystem for transporting each of the wafers into and out of the at least one deposition processing subsystem, the annealing chamber, and the at least one chemical mechanical polishing processing subsystem.

An integrated wafer processing system for processing a plurality of wafers comprising:

• a cassette section for holding wafers that need to be operated upon and wafers that have been operated upon;
• at least one deposition processing subsystem for depositing metal onto the front surface of the wafers;
• a processing area that provides for annealing in one portion and wafer handling in another portion;
• at least one chemical mechanical polishing processing subsystem that contains separate wafer entry and wafer exit points;
• and
• and a wafer handling subsystem for transporting each of the wafers, the wafer handling subsystem including first and second wafer moving devices, wherein:
• the first wafer moving device is capable of taking wafers out of the cassette section, the processing area, and the chemical mechanical polishing processing subsystem and placing wafers into the cassette section and the processing area;
• and
• the second wafer moving device is capable of taking wafers out of the processing area, and the deposition processing subsystem and placing wafers into the deposition processing subsystem, the processing area and the chemical mechanical polishing processing subsystem.

An integrated process tool for operating upon a semiconductor substrate comprising:

• a chemical mechanical processing apparatus that chemically mechanically polishes the substrate;
• a cleaning and drying module that cleans and dries the wafer, and also includes a wafer output area;
• a movable input housing that moves the wafer between a wafer input area and the chemical mechanical processing apparatus;
• and
• another moveable housing that moves the wafer between the chemical mechanical processing apparatus and the cleaning and drying area.

A system for operating upon a wafer comprising:

• a wafer handling area which receives the wafer;
• a first processing module having a chemical mechanical processing apparatus which chemically mechanically polishes the wafer, the first processing module includes a cleaning and drying apparatus which cleans and dries the wafer;
• a first movable input housing which moves the wafer between the wafer handling area and the first processing module;
• and
• a second moveable housing which moves the wafer between the chemical mechanical processing apparatus and the cleaning and drying apparatus.