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US 2003/0166368 A1Published application
Laminate for improved bonding
OwnerAlexander Craig Bushman, James Irvin Marchmaninventors
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Abstract
A laminate structure is provided that results in an improvement in bond performance over existing laminates for applications in which hot melt adhesive is used. The laminate structure includes an inorganic filler loaded into polyolefin to increase the heat transfer and bond strength of the hot melt adhesive to the laminate substrate at lower temperatures than polyolefin alone.
Claims6
A laminate comprising:
- a) a paperboard substrate having an exterior and an interior surface;
- b) a layer of a polyolefin containing an inorganic filler coated onto the exterior surface of the paperboard substrate;
- and
- c) a hot melt adhesive applied to the polyolefin containing the inorganic filler.
1 more element
Dependencies are inferred from the claim text.