Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, David J. Corisis, Salman Akram
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Abstract
A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
Claims8
A multilayer interconnect tape for interconnecting bond pads of a bare semiconductor die to a substrate, said interconnect tape comprising:
- a first layer of insulative film having a first surface and a second surface;
- a second layer of conductive metallic material formed on at least a portion of said first surface of said first layer of insulative film, said second layer of conductive metallic material including a plurality of leads, each lead of said plurality of leads having a first bent end for contacting at least one bond pad of said bond pads of said bare semiconductor die and having a second end for connection to said substrate.
A multilayer tape for interconnecting bond pads of a bare semiconductor die to a substrate, said tape comprising:
- a first layer of insulative film having a first surface and a second surface;
- a second layer of conductive metallic material formed on at least a portion of said first surface of said first layer of insulative film, said second layer of conductive metallic material including a plurality of leads, each lead of said plurality of leads having a first bent end for contacting at least one bond pad of said bond pads of said bare semiconductor die and having a second end for connection to said substrate.
Dependencies are inferred from the claim text.