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US 2003/0166333 A1Published application
Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
AssigneeSeiko Epson Corporation
InventorTakuya Takahashi
Life of this patent
Estimating the term…
Abstract
A tip of a wire formed in the shape of a ball is bonded to an electrode by using a tool. A part of the wire is drawn from the tip bonded to the electrode. A bump is formed on the electrode by deforming a portion of the wire continuous with the tip on the tip by using the tool. The wire is cut while leaving the bump on the electrode.
Claims41
A method for forming a bump comprising steps of:
- (a) bonding a tip of a wire formed in a shape of a ball to an electrode by using a tool;
- (b) drawing a part of the wire from the tip bonded to the electrode;
- (c) deforming the wire at a portion continuous with the tip, on the tip by using the tool;
- and
- (d) cutting the wire while leaving the tip and the deformed portion of the wire on the electrode.
2 more elements
A method of manufacturing a semiconductor element having bumps comprising steps of:
- (a) bonding a tip of a wire formed in a shape of a ball to an electrode of a semiconductor element by using a tool, the semiconductor element having an integrated circuit;
- (b) drawing a part of the wire from the tip bonded to the electrode;
- (c) forming each of the bumps on the electrode by deforming the wire at a portion continuous with the tip, on the tip by using the tool;
- and
- (d) cutting the wire while leaving each of the bumps on the electrode.
2 more elements
A semiconductor element having bumps comprising:
- a semiconductor element which includes an integrated circuit and electrodes;
- and
- bumps provided on the electrodes, respectively, each of the bumps being used for connecting with a wire and including a bottom end connected with each of the electrodes and a top end having an almost smooth surface,
- wherein the top end of each of the bumps is formed so that a width of the top end elongated in a drawing direction of the wire, and a height of the top end decreases as a distance from the wire increases along the drawing direction of the wire.
1 more element
A semiconductor element having bumps comprising:
- a semiconductor wafer which includes a plurality of integrated circuits and electrodes formed on an edge portion of a region including each of the integrated circuits;
- and
- bumps provided on the electrodes, respectively, each of the bumps having a bottom end connected with each of the electrodes and a top end having an almost smooth surface,
- wherein the top end of each of the bumps is formed so that a width of the top end is elongated in a direction from the edge portion to a center portion of the region, and a height of the top end decreases along the direction from the edge portion to the center portion of the region.
1 more element
A semiconductor element having bumps comprising:
- a semiconductor chip which includes an integrated circuit and electrodes formed on an edge portion of the semiconductor chip;
- and
- bumps provided on the electrodes, respectively, each of the bumps having a bottom end connected with each of the electrodes and a top end having an almost smooth surface,
- wherein the top end of each of the bumps is formed so that a width of the top end is elongated in a direction from the edge portion to a center portion of the semiconductor chip, and a height of the top end decreases along the direction from the edge portion to the center portion of the semiconductor chip.
1 more element
Dependencies are inferred from the claim text.