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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsHidenobu Nishikawa, Kazuto Nishida, Kazumichi Shimizu, Hiroyuki Otani
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A semiconductor element mounting method is provided with high productivity. The method includes forming bumps on electrodes of a wafer in which a plurality of semiconductor elements have been formed, temporarily compression-bonding the wafer and an interposer via an insulative resin, curing the resin by heating and pressurization so that the wafer and the interposer are finally compression-bonded, where the electrodes of the wafer and electrodes of the interposer are bonded to each other, respectively, and where insulative resin overflowing from between the wafer and the interposer flows into grooves disposed so as to be coincident with dicing lines of the wafer, thus giving a uniform flow of the insulative resin, and thereafter, cutting and separating into individual semiconductor elements.
A method for mounting semiconductor elements, comprising:
The semiconductor element mounting method according to claim 14, wherein for the heating in the stud bump formation, the second stage moves in synchronization with move of the semiconductor element formation region where the stud bumps are to be formed, so as to normally suck and hold, and heat, the surface of the semiconductor element formation region opposite to the stud-bump formation surface where the stud bumps are to be formed.
Dependencies are inferred from the claim text.