Methods for assembly and packaging of flip chip configured dice with interposer

A method of assembling a flip-chip semiconductor device assembly, the method comprising:

• providing a wafer having an active surface and a back surface and including a plurality of unsingulated semiconductor dice, at least some semiconductor dice of the plurality having conductive bumps protruding transversely from said active surface;
• providing a wafer scale interposer substrate having a first surface and a second surface, said interposer substrate including a plurality of unsingulated interposer substrates each having conductive elements thereon adjacent said second surface, each unsingulated interposer substrate dimensioned and located to correspond with one of said plurality of semiconductor dice of said wafer, each of said plurality of interposer substrates having a plurality of recesses extending thereinto from said first surface, each of said plurality of recesses extending thereinto from said first surface to expose at least a portion of one of said conductive elements;
• and
• placing said wafer with said active surface facing said first surface of said wafer scale interposer substrate and said unsingulated semiconductor dice in alignment with said unsingulated interposer substrates and disposing each of said plurality of conductive bumps protruding transversely from said active surface into a recess of said plurality of recesses of said interposer substrates so that said conductive bumps are substantially received within said plurality of recesses in said interposer substrate.