Thin film coating having transparent base layer
AssigneeCardinal CG Company
InventorsKlaus Hartig, Annette J. Krisko
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Abstract
The invention provides thin film coatings that have a transparent base layer. For example, the invention provides low-emissivity coatings with a transparent base layer. In certain embodiments, a silicon dioxide base layer is used. Methods of producing thin film coatings having a transparent base layer are provided as well. In one embodiment, sputter deposition is utilized to produce these coatings.
Claims47
A substrate bearing a low-emissivity coating, the low-emissivity coating comprising, moving outwardly from the substrate:
- a) a first film layer comprising silicon dioxide formed directly upon the substrate at a thickness of less than 100 angstroms;
- b) a second film layer comprising a transparent dielectric material;
- c) a third film layer comprising an infrared-reflective material;
- and
- d) a fourth film layer comprising a transparent dielectric material.
A substrate bearing a silver-based low-emissivity coating, the low-emissivity coating including a first film layer comprising silicon dioxide formed directly upon the substrate at a thickness of less than 100 angstroms, the coating further including at least one infrared-reflective silver-containing film layer.
A transparent substrate having a given index of refraction, the substrate bearing a low-emissivity coating comprising, moving outwardly from the substrate:
- a) a first film layer comprising transparent material having an index of refraction substantially equal to that of the substrate, the first film layer being formed directly upon the substrate at a thickness of less than 100 angstroms;
- b) a second film layer comprising a transparent dielectric material;
- c) a third film layer comprising an infrared-reflective material;
- and
- d) a fourth film layer comprising a transparent dielectric material.
A transparent substrate having a given index of refraction, the substrate having a moisture-corroded major surface bearing a low-emissivity coating comprising, moving outwardly from the substrate:
- a) a first film layer of amorphous material formed directly upon said moisture-corroded major surface of the substrate, the first film layer having a thickness of less than 100 angstroms;
- b) a second film layer comprising a transparent dielectric material;
- c) a third film layer comprising an infrared-reflective material;
- and
- d) a fourth film layer comprising a transparent dielectric material.
A substrate bearing a low-emissivity coating, the low-emissivity coating comprising, moving outwardly from the substrate:
- a) a first film layer comprising silicon dioxide formed directly on the substrate;
- b) a second film layer comprising a transparent dielectric material;
- c) a third film layer comprising an infrared-reflective material;
- d) an intermediate film region comprising at least three film layers;
- f) a seventh film layer comprising an infrared-reflective material;
- and
- g) an eighth film layer comprising a transparent dielectric material.
A substrate bearing a low-emissivity coating, the low-emissivity coating comprising, moving outwardly from the substrate:
- a) a first film layer comprising silicon dioxide formed directly upon the substrate;
- b) a second film layer comprising a transparent dielectric material;
- c) a third film layer comprising an infrared-reflective material;
- d) a fourth, protective film layer formed directly upon the third film layer, the fourth, protective film layer being a niobium-containing film layer;
- and
- e) a fifth film layer comprising a transparent dielectric material.
A substrate bearing a low-emissivity coating, the low-emissivity coating comprising, moving outwardly from the substrate:
- a) a first film layer comprising silicon dioxide formed directly upon the substrate at a thickness of less than 100 angstroms;
- b) a second film layer comprising an oxide of zinc and tin;
- c) a third film layer comprising an oxide of zinc;
- d) a fourth film layer comprising an infrared-reflective material;
- e) a protective fifth film layer formed directly upon the fourth film layer;
- f) a sixth film layer comprising an oxide of zinc;
- g) a seventh film layer comprising an oxide of zinc and tin;
- h) an eighth film layer comprising an oxide of zinc;
- i) a ninth film layer comprising an infrared-reflective material;
- j) a protective tenth film layer formed directly upon the ninth film layer;
- k) an eleventh film layer comprising an oxide of zinc;
- l) a twelfth film layer comprising an oxide of zinc and tin;
- and
- m) a thirteenth film layer comprising silicon nitride.
A substrate bearing a low-emissivity coating, the low-emissivity coating comprising, moving outwardly from the substrate:
- a) a first film layer comprising silicon dioxide formed directly upon the substrate at a thickness of less than 100 angstroms;
- b) a second film layer comprising titanium oxide or silicon nitride;
- c) a third film layer comprising an oxide of zinc;
- d) a fourth film layer comprising an infrared-reflective material;
- e) a protective fifth film layer formed directly upon the fourth film layer;
- f) a sixth film layer comprising silicon nitride;
- g) a seventh film layer comprising an oxide of zinc;
- h) an eighth film layer comprising an infrared-reflective material;
- j) a protective ninth film layer formed directly upon the eighth film layer;
- and
- k) a tenth film layer comprising silicon nitride.
Dependencies are inferred from the claim text.