Copper deposition using copper formate complexes
AssigneeE. I. Du Pont de Nemours and Company
InventorJeffery Scott Thompson
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Abstract
The present invention relates to novel copper formate complexes and the deposition of metallic copper on substrates or in or on porous solids using these novel copper complexes.
Claims12
A composition comprising copper, two formate ions coordinated to the copper, and two aromatic nitrogen heterocyclic ligands coordinated to copper through nitrogen, wherein the aromatic nitrogen heterocyclic ligands are selected from the group consisting of C10-C20 alkyl-substituted pyridines, C9-C20 alkyl-substituted pyrazoles, C9-C20 alkyl-substituted imidazoles and C9-C20 alkyl-substituted triazoles, in which the N1 position of the pyrazole, imidazole and triazole ligands are alkyl-substituted.
Dependencies are inferred from the claim text.