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US 2003/0165305 A1Published application
Adhesive for bonding an optoelectronic device
OwnerJoseph L. Dallas, Angelique X. Irvin +3inventors
InventorsJoseph L. Dallas, Angelique X. Irvin, Robert W. Irvin, Ralph S. Jameson, William A. Mamakos
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Abstract
An adhesive for bonding an optoelectronic device within a hermetically sealable package comprising a low outgassing adhesive selected to limit the outgassing of organic molecules in a cured state.
Claims33
An adhesive for bonding an optoelectronic device within a hermetically sealable package comprising:
- a low outgassing adhesive selected to limit the outgassing of organic molecules in a cured state.
An adhesive for bonding an optoelectronic device within a hermetically sealable package comprising:
- a low outgassing adhesive selected to limit the outgassing of organic molecules in a cured state, wherein said low outgassing adhesive includes low volatile organic compounds (VOC), said low VOC have a percent weight loss of less than about 0.5% at a temperature of up to about 120° F. (48.9° C.).
A hermetically sealable package having an optoelectronic device bonded therein comprising:
- a housing configured to form a hermetic seal therein;
- an optoelectronic device disposed within said package;
- and
- a low outgassing adhesive bonding said optoelectronic device within said package, said low outgassing adhesive selected to limit the outgassing of organic molecules in a cured state in said hermetically sealable package.
1 more element
Dependencies are inferred from the claim text.