Modular integrated circuit chip carrier
AssigneeLegacy Electronics, Inc.
InventorsKenneth J. Kledzik, Jason C. Engle
Life of this patent
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Abstract
An apparatus and method is disclosed that allows for the arranging in a three dimensional array semiconductor chips on a circuit board. A unique chip carrier is disclosed on which any IC chip can be positioned on above the other on a circuit board. Additionally, the carrier allows for the testing of IC chips on the carrier and underneath it without having to remove the carrier and chips from the system even if they are of the BGA or CSP type. The carrier includes exposed test points to allow an on site test.
Claims93
A carrier for arranging integrated circuit chips in a three-dimensional array on a circuit board, said carrier comprising:
- a) a platform with a top surface and a bottom surface;
- b) a first strut at a first side of said platform and a second strut at a second side of said platform, said struts providing support for said platform and thereby creating a space below the bottom surface of said platform;
- c) said platform having a pattern of connection pads on its top surface for receiving at least one integrated chip on the top surface on the pattern of connection pads, a bottom side of each pad of said pattern of pads being connected to a via that pass down through said platform to a lower layer in said platform wherein said via connects to a conductive path that extend towards said first or second strut;
- d) said first and second struts having strut vias that extend up through each strut from the bottom of said strut to the top of said strut wherein each of said strut vias connect to a specific conductive path in said platform which specific conductive path connects to a specific via descending from a pad of the pads of the pattern of connection pads;
- and
- e) wherein said carrier forms a modular unit that can accept at least one integrated chip on the top surface of said platform on said pattern of connection pads and connect that chip to a printed circuit board to which said carrier is attached and provide in the space below the bottom surface of said carrier room for attaching at least a second integrated circuit chip to a circuit board on which said carrier is attached.
A method for arranging IC chips on a circuit board in a three-dimensional array, said method comprising the steps of
- a) providing a platform for receiving a first IC chip;
- b) providing at least one support strut to support said platform and thereby form a carrier;
- c) connecting electronically said chip through the platform and the strut to a circuit board when the carrier is connected to a circuit board;
- d) forming the at least one strut and platform in a configuration that allows for space beneath a bottom portion of the platform so that when the carrier is attached to a circuit board there is space beneath the platform for connecting a second IC chip to a circuit board;
- and
- e) providing test contacts on the carrier that are accessible when the carrier is attached to the board and an IC chip is connected to the top of the platform.
A carrier for arranging IC chips on a circuit board in a three-dimensional array, said carrier comprising:
- a) means for providing a platform for receiving a first IC chip;
- b) means for supporting said platform to thereby form a carrier with a space beneath said carrier to thereby provide room for connection of a second IC chip to a circuit board when said carrier is a attached to a circuit board;
- and
- c) means for electrically connecting, through said means for supporting said platform, a first IC chip that is connected to the top of said carrier to a circuit board when the said carrier is connected to a board.
A carrier for arranging IC chips on a circuit board in a three-dimensional array, said carrier comprising:
- a) a platform for receiving a first IC chip;
- b) at least one strut for supporting said platform to thereby form a carrier with a space beneath said carrier to thereby provide room for connection of a second IC chip to a circuit board when said carrier is a attached to a circuit board;
- and
- c) an electrically connecting path from connection pads on a top of said platform for receiving and connecting a first IC chip, through said platform, and said at least one strut to connection points at at a bottom of said one strut when said carrier is connected to a circuit board.
Dependencies are inferred from the claim text.