Structure of electronic device providing decreased fatigue of wire
AssigneeDenso Corporation
InventorKazuhiko Koga
Life of this patent
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Abstract
An electronic device such as a semiconductor pressure sensor is provided which has a buffer disposed within a resinous casing. Terminals extend through the casing and connect electrically with an electronic element mounted on the casing through wires. The buffer is made of a material having a coefficient of thermal expansion smaller than that of the body of the casing, thereby decreasing undesirable movement of the terminals leading to fatigue of the wires which arises from a change in temperature of the casing. This minimizes a drop in mechanical strength of the wires caused by thermal cycling to which the casing is subjected.
Claims7
An electronic device comprising:
- a casing having a body made of resin;
- a metallic terminal having a length, said metallic terminal extending through the body of said casing to have ends thereof extending outside the body of said casing;
- an electronic element mounted on a surface of the body of said casing;
- a wire establishing an electrical connection between said electronic element and the end of said terminal;
- and
- a buffer disposed adjacent said terminal within the body of said casing, said buffer being made of a material having a coefficient of thermal expansion smaller than that of the resin forming the body of said casing.
Dependencies are inferred from the claim text.