Microprocessor retention system and method
AssigneeDell Products L.P.
InventorsZachary A. Cravens, Shawn P. Hoss
Life of this patent
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Abstract
A microprocessor retention system and method is disclosed in which a base of a retention system is coupled to a method board. The base of the retention system includes a number of slots or openings for receiving a microprocessor and an associated heat sinks. The cover of the retention system includes a number of individually coiled springs. When the cover is secured to the base, the springs apply a compressive force to the heat sinks, placing the heat sinks in thermal contact with the associated microprocessors. The structure of the base and cover of the heat sink creates a plenum for the flow of air across the heat sinks of the microprocessor retention system.
Claims21
An apparatus for retaining a plurality of microprocessors, comprising:
- a base having formed therein a plurality of microprocessor openings and including a microprocessor placed in each microprocessor opening;
- a cover removably coupled to the base;
- a heat sink associated with and placed in contact with each microprocessor;
- and
- a spring coupled to the cover, wherein the spring exerts pressure on the base of the heat sinks to force the heat sinks in contact with their respective microprocessors.
A method for assembling a microprocessor retention system in a computer system, comprising the steps of:
- coupling a base of the microprocessor retention system to the motherboard of the computer system, the base having a number of slots for receiving one or more microprocessors;
- placing at least one microprocessor in one of the slots of the base;
- placing a heat sink in contact with each microprocessor;
- coupling a cover to the base such that a spring coupled to the cover causes a compressive force to be exerted on the base of each heat sink and the associated microprocessor in the slots of the base.
A computer system, comprising:
- a housing;
- a motherboard;
- a base of a microprocessor retention system, the base having a plurality of slots for receiving one or more microprocessors;
- one or more microprocessors located in the slots of the base;
- a plurality of heat sinks, each of the heat sinks associated with and positioned near the surface of one of the microprocessors located in the slots of the base;
- and
- a cover coupled to the base, wherein the cover includes a spring that applies a compressive force to the lower surface of the heat sinks and associated microprocessors.
Dependencies are inferred from the claim text.