Thin film magnetic head comprising conductive pad including two insulating protective layers and manufacturing method therefor

A method of manufacturing a thin film magnetic head comprising a reproducing magnetoresistive element, a lead conductor layer for supplying a current to the magnetoresistive element, a conductive protective layer deposited on the lead conductor layer, a conductive bump formed on the conductive protective layer, and an insulating protective layer formed around the conductive protective layer and the conductive bump, the method comprising the steps of:

• (a) forming a first insulating protective sub-layer around the conductive protective layer so that the surface of the first insulating protective is coplanar with the surface of the conductive protective layer;
• (b) forming the conductive bump on the conductive protective layer;
• and
• (c) forming a second insulating protective sub-layer on the flat surface formed by the conductive protective layer and the first insulating protective sub-layer, and on the conductive bump to form the insulating protective layer.

A method of manufacturing a thin film magnetic head comprising a coil layer for inducing a recording magnetic field between lower and upper core layers, a lead conductor layer for supplying a current to the coil layer, a conductive protective layer deposited on the lead conductor layer, a conductive bump formed on the conductive protective layer, and an insulating protective layer formed around the conductive protective layer and the conductive bump, the method comprising the step of:

• (a) forming a first insulating protective sub-layer around the conductive protective layer so that the first insulating protective sub-layer is coplanar with the surface of the conductive protective layer;
• (b) forming the conductive bump on the conductive protective layer;
• and
• (c) forming a second insulating protective sub-layer on the flat surface formed by the conductive protective layer and the first insulating protective sub-layer, and on the conductive bump to form the insulating protective layer.