Alignment apparatus for an IC test handler

An alignment apparatus for an IC test handler, comprising:

• a load board stiffener, wherein said load board stiffener further comprises:
• at least one first depression area and at least one second depression are, wherein said least one second depression area is located inside said at least one first depression area;
• a plurality of first guide pins, wherein said plurality of first guide pins are fixed on said load board stiffener for aligning said IC test handler;
• a plurality of second guide pins, wherein said plurality of second guide pins are fixed on said load board stiffener for aligning an IC device;
• a plurality of first guide pin holes and a plurality of second guide pin holes, wherein said plurality of first guide pin holes and said plurality of second guide pin holes are implemented on said load board that is mounted on said load board stiffener, said plurality of first guide pin holes corresponding to said plurality of first guide pins respectively, said plurality of second guide pin holes corresponding to said plurality of second guide pins respectively, thereby allowing said plurality of first guide pins and said plurality of second guide pins to penetrate said load board toward from a lower surface of said load board toward an upper surface opposite to said lower surface via said plurality of first guide pin holes and said plurality of second guide pin holes, said lower surface having a plurality of electrical circuit components;
• and
• a surface mount matrix (SMM) frame member mounted on said upper surface of said load board for fixing a SMM, wherein said SMM is fixed on a surface of an opening located at the central area of said SMM frame member, said SMM frame member having a plurality of first SMM holes and a plurality of second SMM holes, said plurality of first SMM holes corresponding to said plurality of first guide pins respectively, said plurality of second SMM holes corresponding to said plurality of second guide pins respectively, thereby allowing said plurality of first guide pins and said plurality of second guide pins to penetrate said SMM frame member respectively from said surface having said SMM toward an other surface opposite to said surface via said plurality of first SMM holes and said plurality of second SMM holes.