Composite interposer for BGA packages
AssigneeMicron Technology, Inc.
InventorsTongbi Jiang, Edward Schrock
Life of this patent
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Abstract
An interposer in a BGA or similar package includes a polymide core and a filler of thermally conductive, electrically nonconductive filler. The interposer has a higher thermal conductivity as compared to conventional interposers, thereby increasing the thermal dissipation through the interposer and enabling the device to cool more efficiently. The filler also reduces the coefficient of thermal expansion of the interposer to more closely match the die and reduce stresses. Furthermore, the filler increases the rigidity of the interposer, thereby enabling the interposer to be handled and carried more easily, for example, without a metal frame carrier.
Claims26
An interposer for an integrated circuit package, comprising:
- a polyimide core;
- and
- a thermally conductive, electrically nonconductive filler.
An interposer for a ball grid array package, comprising:
- a polyimide core;
- and
- a nitride filler material wherein the filler material increases the thermal conductivity by about 50% or more, reduces the coefficient of thermal expansion by about 10% or more, and increases the modulus of elasticity by about 10% or more as compared to that of the polyimide core alone.
An interposer for an integrated circuit package, comprising:
- a polyimide core;
- and
- a inorganic filler material that provides for efficient cooling, increased stress resistance, and increased rigidity of the interposer as compared to that of the polyimide core without the inorganic filler.
Dependencies are inferred from the claim text.