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OwnerQuinn K. Tong, Yue Xiao +2inventors
InventorsQuinn K. Tong, Yue Xiao, Bodan Ma, Gyanendra Dutt
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A curable underfill encapsulant composition that is applied directly onto semiconductor wafers before the wafers are diced into individual chips. The composition comprises a thermally curable resin system comprising an epoxy resin, a phenol-containing compound such as phenol or phenolic resin, a solvent, an imidazole-anhydride curing agent, inorganic fillers, fluxing agents, and optionally, wetting agents. Various other additives, such as defoaming agents, adhesion promoters, flow additives and rheology modifiers may also be added as desired. The underfill encapsulant is B-stageable to provide a coating on the wafer that is smooth, non-tacky and will allow the wafer to be cleanly diced into individual chips. A method for producing an electronic package containing the B-stageable material may also utilize an unfilled liquid curable fluxing material on the substrate to which the chip is to be attached.
A B-stageable underfill encapsulant, wherein the encapsulant solidifies during the B-stage process to produce a smooth, non-tacky surface on a semiconductor wafer or silicon chip.
A silicon wafer having a B-stageable underfill composition deposited on one face of the wafer, the B-stageable composition comprising
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