Semiconductor device and manufacturing method for the same, circuit board, and electronic device
AssigneeSeiko Epson Corporation
InventorToshinori Nakayama
Life of this patent
Estimating the term…
Abstract
To improve the productivity of manufacturing semiconductor devices having a heat sink, the semiconductor device manufacturing method includes: (a) setting an integral heat radiation body set 30 of multiple heat radiation bodies 32 in a mold 40 cavity 42; (b) setting a substrate 10 on which multiple semiconductor chips 20 are mounted in a planar arrangement in the mold 40 so that the multiple semiconductor chips 20 are located inside the cavity 42; and (c) sealing the multiple semiconductor chips 20 and affixing the heat radiation body set 30 by filling the cavity 42 with a sealant.
Claims26
A manufacturing method for a semiconductor device comprising:
- (a) setting a heat radiation body set, which is an integral set of multiple heat radiation bodies, in a mold cavity;
- (b) setting a substrate on which multiple semiconductor chips are mounted in a planar arrangement in the mold so that the multiple semiconductor chips are located inside the cavity;
- and
- (c) sealing the multiple semiconductor chips and affixing the set of multiple heat radiation bodies by filling the cavity with a sealant.
A semiconductor device comprising:
- a substrate;
- a plurality of semiconductor chips mounted in a planar arrangement on the substrate;
- a sealed part formed by sealing the multiple semiconductor chips on the substrate en masse;
- and
- a heat radiation body set containing multiple integrally formed parts that are heat radiation bodies for the semiconductor chips.
Dependencies are inferred from the claim text.