Semiconductor module including a plurality of semiconductor devices detachably
AssigneeFujitsu Limited
InventorsMitsutaka Sato, Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshimi Kawahara, Toshio Hamano, Yoshihiro Kubota, Mitsunada Osawa, Yoshiyuki Yoneda, Kazuto Tsuji, Hirohisa Matsuki
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Abstract
A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.
Claims36
A semiconductor device, comprising:
- a substrate carrying a single semiconductor chip thereon;
- an interconnection pattern provided on said substrate in electrical connection with said semiconductor chip;
- and
- a plurality of contacts provided on an edge of said substrate in electrical connection with said interconnection pattern.
A semiconductor module, comprising:
- a plurality of semiconductor devices each including:
- a substrate carrying a single semiconductor chip thereon;
- an interconnection pattern provided on said substrate;
- and a plurality of contacts provided on an edge of said substrate in electrical connection with said interconnection pattern;
- and
- a socket holding said plurality of semiconductor devices detachably, said socket engaging said plurality of contacts of said plurality of semiconductor devices detachably.
A socket for holding a plurality of semiconductor devices detachably in an erected state, each of said semiconductor devices carrying a plurality of contacts terminals, said socket including a plurality of socket components provided in correspondence to said plurality of contact terminals on said semiconductor devices, each of said socket components comprising:
- a socket main body;
- a plurality of contacts provided on said socket main body, said plurality of contacts being adapted for engagement with a plurality of corresponding contact terminals on said plurality of semiconductor devices mechanically, said plurality of contacts on said socket main body establishing an electrical contact with said plurality of corresponding contact terminals of said semiconductor devices and holding said plurality of corresponding contacts of said semiconductor devices detachably;
- and
- a plurality of terminals provided on said socket main body in electrical connection with said plurality of contacts on said socket main body.
A socket for holding a plurality of semiconductor devices detachably, each of said semiconductor devices carrying a plurality of contact terminals, said socket including a plurality of socket components provided in correspondence to said plurality of contact terminals on said semiconductor devices, each of said socket components comprising:
- a socket main body;
- a plurality of contact pins provided on said socket main body, said plurality of contact pins being adapted for engagement with a plurality of corresponding contact terminals on said plurality of semiconductor devices resiliently, said plurality of contact pins on said socket main body thereby establishing an electrical contact with said plurality of corresponding contact terminals of said semiconductor devices;
- a plurality of terminals provided on said socket main body in electrical connection with said plurality of contact pins on said socket main body;
- and
- a housing member for holding said plurality of semiconductor devices when said semiconductor devices are mounted upon said socket.
A socket for holding a plurality of semiconductor devices detachably, each of said semiconductor devices carrying a plurality of contact terminals, said socket including a plurality of socket components provided in correspondence to said plurality of contact terminals on said semiconductor devices, each of said socket components comprising:
- a socket main body;
- a plurality of contact pins provided on said socket main body, said plurality of contact pins being adapted for engagement with a plurality of corresponding contact terminals on said plurality of semiconductor devices resiliently, said plurality of contact pins on said socket main body thereby establishing an electrical contact with said plurality of corresponding contact terminals of said semiconductor devices;
- a plurality of terminals provided on said socket main body in electrical connection with said plurality of contact pins on said socket main body;
- and
- a movable actuation member for moving said plurality of contact pins, said movable actuation member being movable between a first position and a second position, said movable actuation member urging said plurality of contact pins, when in said first position, such that said plurality of contact pins are in contact with said corresponding contact terminals on said semiconductor devices, said movable actuation member releasing said plurality of contact pins, when in said second position, such that said plurality of contact pins are disengaged from said corresponding contact terminals on said semiconductor devices.
A socket for holding a plurality of semiconductor devices detachably, each of said semiconductor devices carrying a plurality of contact terminals, said socket including a plurality of socket components provided in correspondence to said plurality of contact terminals on said semiconductor devices, each of said socket components comprising:
- a socket main body;
- a plurality of contact pins provided on said socket main body, said plurality of contact pins being adapted for engagement with a plurality of corresponding contact terminals on said plurality of semiconductor devices resiliently, said plurality of contact pins on said socket main body thereby establishing an electrical contact with said plurality of corresponding contact terminals of said semiconductor devices;
- a plurality of terminals provided on said socket main body in electrical connection with said plurality of contact pins on said socket main body;
- and
- a movable carriage for moving said plurality of semiconductor devices, said movable carriage being movable between a first position and a second position, said movable carriage urging said plurality of semiconductor devices, when in said first position, such that said plurality of contact pins are in contact with said corresponding contact terminals on said semiconductor devices, said movable carriage releasing said plurality of semiconductor devices, when in said second position, such that said plurality of contact pins are disengaged from said corresponding contact terminals on said semiconductor devices.
A semiconductor module, comprising:
- a plurality of semiconductor devices each comprising:
- a substrate carrying a single semiconductor chip thereon;
- an interconnection pattern provided on said substrate in electrical connection with said semiconductor chip;
- and a plurality of contacts provided on an edge of said substrate in electrical connection with said interconnection pattern;
- and
- a socket for holding said plurality of semiconductor devices detachably, said socket comprising:
- a socket main body;
- a plurality of contacts provided on socket main body, said plurality of contacts being adapted for engagement with said plurality of contacts provided on each of said plurality of semiconductor devices mechanically, said plurality of contacts on said socket main body establishing an electrical contact with said corresponding contacts of said plurality of semiconductor devices and holding said contacts of said plurality of semiconductor devices detachably;
- and a plurality of terminals provided on said socket main body in electrical connection with said contacts on said socket main body.
Dependencies are inferred from the claim text.